You're looking at a product cost and emissions model for a ISOCELL HP2 (200 MP) manufactured in United States. HP2
Each model includes upstream materials, components, and manufacturing processes all the way to the factory gate.
Product Material Breakdown
Top Cost Contributors
Materials: CMOS Silicon Die (32%)
Materials: CMOS Silicon Die (32%)
Value Add (27%)
Value Add (27%)
Materials: Aluminum Wire Bonds (12%)
Materials: Aluminum Wire Bonds (12%)
Labor: Indirect Labor (12%)
Labor: Indirect Labor (12%)
Your biggest cost drivers represent the highest potential for savings
Alternative Sourcing Scenarios
Current sourcing location
United States
Alternative Sourcing | Estimated Cost Impact | Estimated CO2e Emissions Impact |
|---|---|---|
United States | +9.5% | -12.5% |
Current sourcing location
United States
Alternative Sourcing | Estimated Cost Impact | Estimated CO2e Emissions Impact |
|---|---|---|
Alternative Designs & Materials Recommendations
Score: 6.0/10
Work with your supplier to transition to renewable energy.
Emission Intensity Impact
-5.3%
Cost Impact
0.0%
Implementation Difficulty
Score: 5.5/10
Work with your supplier to source epoxy resin for encapsulation from South Korea.
Emission Intensity Impact
0.0%
Cost Impact
0.0%
Implementation Difficulty
Analyze your own product
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Analyze your own product
Go beyond general models. Upload or import any Bill of Materials to instantly see detailed cost, carbon, and risk insights.
Smart sourcing
Compare sourcing locations, suppliers, and transportation side by side. Instantly see how costs, emissions, and risks shift when you change where a product is made.
Smart sourcing
Compare sourcing locations, suppliers, and transportation side by side. Instantly see how costs, emissions, and risks shift when you change where a product is made.
Optimize Designs & Materials
Explore alternative materials, components, and configurations to balance cost, carbon, and risk. Make informed trade-offs early in the design cycle to launch better products, faster.
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Top Emission Contributors
0.04
kgCO2e
Materials: CMOS Silicon Die (91%)
Materials: CMOS Silicon Die (91%)
Manufacturing (7%)
Manufacturing (7%)
Materials: Copper Alloy Lead Frame (1%)
Materials: Copper Alloy Lead Frame (1%)
Materials: Epoxy Resin (Encapsulation) (0%)
Materials: Epoxy Resin (Encapsulation) (0%)
Your biggest emission drivers represent the highest potential for savings
Even small design or sourcing changes can create outsized impact and drive meaningful reductions.
Manufacturer Should Cost
$
.91
USD
Note: This analysis covers Materials, Components, and Manufacturing only; it does not include downstream costs (e.g., outbound shipping, warehousing, distribution/retail fees).
Tariff Impact
+0%
of Landed Cost
HTS Code
85299013
Sourced from
United States
Tariffs can materially change landed cost and competitiveness
United States
+9.5% |
-12.5% |
Optimize Designs & Materials
Explore alternative materials, components, and configurations to balance cost, carbon, and risk. Make informed trade-offs early in the design cycle to launch better products, faster.
Strengthen Supplier Strategy
Uncover true cost drivers to gain leverage in supplier negotiations. Collaborate with suppliers on improvements like renewable energy adoption, material shifts, or process changes to enhance resilience and sustainability.
Strengthen Supplier Strategy
Uncover true cost drivers to gain leverage in supplier negotiations. Collaborate with suppliers on improvements like renewable energy adoption, material shifts, or process changes to enhance resilience and sustainability.