You're looking at a product cost and emissions model for a Micron Technology HBM3E high-bandwidth memory manufactured in Japan. Each model includes upstream materials, components, and manufacturing processes all the way to the factory gate.
Product Material Breakdown
Top Cost Contributors
Materials: silicon (DRAM integrated circuit die) (35%)
Materials: silicon (DRAM integrated circuit die) (35%)
Value Add (26%)
Value Add (26%)
Labor: Indirect Labor (12%)
Labor: Indirect Labor (12%)
Materials: silicon (logic base integrated circuit die) (8%)
Materials: silicon (logic base integrated circuit die) (8%)
Your biggest cost drivers represent the highest potential for savings
Alternative Sourcing Scenarios
Current sourcing location
Japan
Alternative Sourcing | Estimated Cost Impact | Estimated CO2e Emissions Impact |
|---|---|---|
 United States | +10.2% | -21.4% |
 Malaysia | -15.5% | +6.0% |
Alternative Designs & Materials Recommendations
Score: 8.9/10
Work with your supplier to transition to renewable energy.
Emission Intensity Impact
-43.6%
Cost Impact
0.0%
Implementation Difficulty
Score: 5.5/10
Work with your supplier to source copper through-silicon vias from Japan.
Emission Intensity Impact
0.0%
Cost Impact
0.0%
Implementation Difficulty
Analyze your own product
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Analyze your own product
Go beyond general models. Upload or import any Bill of Materials to instantly see detailed cost, carbon, and risk insights.
Smart sourcing
Compare sourcing locations, suppliers, and transportation side by side. Instantly see how costs, emissions, and risks shift when you change where a product is made.
Smart sourcing
Compare sourcing locations, suppliers, and transportation side by side. Instantly see how costs, emissions, and risks shift when you change where a product is made.
Optimize Designs & Materials
Explore alternative materials, components, and configurations to balance cost, carbon, and risk. Make informed trade-offs early in the design cycle to launch better products, faster.
Detailed should-cost models with cost drivers
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Visibility into drivers gives you leverage in design, sourcing, and supplier discussions
Top Emission Contributors
0.1
kgCO2e
Manufacturing (50%)
Manufacturing (50%)
Materials: silicon (interposer) (27%)
Materials: silicon (interposer) (27%)
Materials: silicon (DRAM integrated circuit die) (15%)
Materials: silicon (DRAM integrated circuit die) (15%)
Materials: silicon (logic base integrated circuit die) (5%)
Materials: silicon (logic base integrated circuit die) (5%)
Your biggest emission drivers represent the highest potential for savings
Even small design or sourcing changes can create outsized impact and drive meaningful reductions.
Manufacturer Should Cost
$
.65
USD
Note: This analysis covers Materials, Components, and Manufacturing only; it does not include downstream costs (e.g., outbound shipping, warehousing, distribution/retail fees).
Tariff Impact
+10%
of Landed Cost
HTS Code
85423200
Sourced from
Japan
Tariffs can materially change landed cost and competitiveness
 Taiwan |
-5.5% |
+6.0% |
Current sourcing location
Japan
Alternative Sourcing | Estimated Cost Impact | Estimated CO2e Emissions Impact |
|---|---|---|
United States | +10.2% | -21.4% |
Malaysia | -15.5% | +6.0% |
Taiwan | -5.5% | +6.0% |
Optimize Designs & Materials
Explore alternative materials, components, and configurations to balance cost, carbon, and risk. Make informed trade-offs early in the design cycle to launch better products, faster.
Strengthen Supplier Strategy
Uncover true cost drivers to gain leverage in supplier negotiations. Collaborate with suppliers on improvements like renewable energy adoption, material shifts, or process changes to enhance resilience and sustainability.
Strengthen Supplier Strategy
Uncover true cost drivers to gain leverage in supplier negotiations. Collaborate with suppliers on improvements like renewable energy adoption, material shifts, or process changes to enhance resilience and sustainability.